With the rapid development of the electronic components industry, LCD screens are also used in various industries, such as automobiles, small home appliances, disinfection machines, beauty equipment, medical equipment, and other fields. Many salesmen often encounter customer inquiries about what are the common ways of connecting LCD and IC and how the difference is, what are the advantages and disadvantages of the LCD screen connection? Ltd. technical staff to give a brief introduction, I hope it will help you.
What are the LCD connection methods and how are they different, there are mainly the following five connection methods?
(1) SMT connection
SMT is what it means: the English abbreviation is “Surface mount technology”, Chinese: surface mount technology, which is a more traditional installation method.
Advantages: high reliability.
Disadvantages: large size, high cost, limiting the miniaturization of LCM.
(2) COB connection method
COB is what it means: the English abbreviation is “Chip On Board”, Chinese: the chip is bonded (Bonding) on the PCB, is a chip production process in a way to hit the line, generally used for packaging before the chip internal circuit with gold wire and package pin connection. Generally, after bonding (i.e., after the circuit is connected to the pins), the chip is encapsulated with a black gel, while using advanced external packaging technology COB, the process of this process is to have tested the wafer implanted on a special circuit board, and then the wafer circuit is connected to the board with gold wire, and then the organic material with special protection function after melting is covered to the wafer to complete the post-encapsulation of the chip.
Advantages： PCB boards and other materials can be eliminated, which can greatly reduce the volume of the module, while also reducing costs in terms of price.
Disadvantages： Packaging density is slightly smaller than TAB and flip-chip soldering technology. The need for another welding machine and packaging machine, the production technology requirements are extremely strict, such as sometimes the speed can not keep up with the PCB placement of environmental requirements more stringent and can not be maintained.
Development trend: As IC manufacturers in LCD control and related chip production is reducing the production of QFP (SMT a) package, so the traditional SMT connection in future products will be gradually replaced.
(3) TAB connection method
What does TAB mean: The English abbreviation is “Tape Automated Bonding”. The package form of TCP (Tape Carrier Package) IC with anisotropic conductive adhesive fixed on the LCD and PCB respectively.
Advantages: has the advantages of reducing the weight of LCM, volume, easy installation, better reliability, etc.
(4) COG connection method
COG is what it means: the English abbreviation is “Chip On Glass”, Chinese: the chip is directly bonded on the glass. This mounting method can greatly reduce the size of the entire LCD module, and easy to mass production, for consumer electronics LCD, such as cell phones, PDAs, and other portable electronic products. This mounting method will be the main connection method between IC and LCD in the future under the promotion of IC manufacturers.
(5) COF connection method
COF is what it means: the English abbreviation is “Chip On Film”, Chinese: the chip is mounted directly on the flexible PCB. This connection method of higher integration, peripheral components can be installed with the IC on the flexible PCB, which is an emerging technology, has entered the pilot production stage.